To prevent the unintended consequences of the current code requirements and to allow for systems that are simple, safe, and more reliable, we request that code makers make the following changes to the National Electric Code:
Request 1: Revert NEC 2020 690.12 (Module Level Shutdown) to NEC 2014 690.12 (Array Level Shutdown) requirements until proper solutions are available on the market, such as module-integrated, chip-based devices with an open industry standard
Request 2: Revert to NEC 2014 690.12 but keep the 1' array boundary
Request 3: Implementing a maximum electrical noise level requirement for rapid shutdown devices in 690.12
Request 4: Require 690.11 (Arc Fault Circuit Protection) to apply to all solar PV DC circuits, not just those above 80V, to detect any potential fire safety issues
Sign the Petition Now
Also, Most AHJ’s (based on their interruptation of NEC intent) forcing ’blanket’s code requirements, to shut down an array on 1/2 of a residential hip roof, is unwarranted (not a safety issue) & just extra cost to homeowner!
That way no shock can occur when touching the positive line and the roof structure. Then have a separate conduit for both positive and negative separated by 3 ft. In this way the fireman cannot cut through both of the lines with his chainsaw at the same time so he cannot cause a short. To shut the array down, a simple cut off at the inverter is all that is needed to stop the current flow.
It doesn’t need to be any more complicated than that.
If technology advances to accommodate module level, let’s do it. It is way too early yo try this.
Dr. Daniel Dean
Earth Wise Solar Technologies
The breadboard prototype was ready and passed all the tests. But when we tried to package it in a box, we discovered that, the system produced too much (over 60 Watts) heat and thus called for heat sinking and may even a continuously running fan.
A better version is under development now which is expected to produce no more than 12 Watts of heat (for a system with four PV arrays) and hence would not need any heatsinking.
The breadboard system consisting of many innovations in circuit topologies is expected to be ready by end of August 2022.
More devices and more points of failure cause more issues alone.